[US-Japan Patent Obtained] Ultra-Fine Hole Processing Technology
Numerous achievements in precision machinery such as medical devices, analytical instruments, and microscopes! Ultra-fine hole processing technology that realizes a hole diameter of 2 micrometers.
Yamato Technosystems' "Ultra-Fine Hole Processing" is a patented technology with complete removal cleaning finish, with patents obtained in Japan and the United States. (Patent No. 3117687) (U.S. PAT No. US6858263-B2) Our technology resolves all concerns regarding invisible discharge marks and burrs on the surface and inner surfaces of holes after electrical discharge machining. ■ Ideal for medical devices, analytical instruments, microscopes, etc. ■ Achieves a hole diameter of 2 micrometers ■ Quality assurance compatible with electron microscopes up to 5,000 times magnification ■ Inner surface roughness below 100 nanometers ■ Patents obtained in Japan and the United States (Patent No. 3117687) (U.S. PAT No. US6858263-B2) *For more details, please download the catalog or contact us.
- Company:大和テクノシステムズ 本社
- Price:Other